SOLUTIONS FOR SURFACE METROLOGY
Non-contact and fast surface roughness measurement according to international standards.
GLASS, MIRRORS, WAFERS- WLI is ideal for smooth and super smooth surfaces
SURFACE DEFECT DETECTION- Find defects or particels automatically. Measures height, position and size of defects
ELECTRICAL CONTACT SURFACE- 400 µm range, fast scanning speed. CFM Scan with 100X magnification, 0,23 µm lateral and 1 nm height resolution
Measuring the thickness of various print layers
on hybrid substrates
HYBRIDCIRCUIT- SURFACE OF A THICK-FILM RESISTOR
SOLAR CELL- SURFACE OF METALLIZATION LAYER
EPOXY PRINT- 3D volume, height and area measurements
MULTI-LAYER CERAMIC CAPACITOR (MLCC)- PROFILE OF PRINT ON A MLCC TAPE
FUEL CELL- PROFILE OF LARGE PRINT DEPOSIT ON FUEL CELL COMPONENT
DRAM EPOXY PRINT- PROFILE OF EPOXY DEPOTS ON A DRAM SUBSTRATE
TOTAL THICKNESS VARIATION (TTV)
The CT T Series of cyberTECHNOLOGIES is designed for measuring top and bottom side of parts like wafers, substrates, or other mechanical parts. The system measures absolute thickness, thickness variation (TTV), bow and warp, and with an adapter plate to the system can be used as a standard surface measurement system.
SILICON WAFER- 3D THICKNESS MAP OF A SILICON WAFER
FUEL CELL- 3D IMAGE OF THE FRONT AND BACK-SIDE A FUEL CELL ANODE
SOLAR CELL- 2D PROFILE OF FRONT- AND BACK-SIDE METALLIZATION LAYER
TRANSPARENT FILMS AND COATINGS
Transparent films or deposits such as flux or epoxy are difficult to qualify and quantify. While certain materials are invisible for microscopes or AOI systems, our measurement systems can differentiate between several surface layers.
LED DEVICES- Measurement of multilayer films (up to 4 layers). Distance sensors can measure surface and thickness.
FLUX DEPOSIT- Volume, height and area measurement on transparent deposits
COATINGS- Thickness measurement of conformal coatings down to 2 microns. Different interferometer types for a variety of materials
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