Applications Overview

SOLUTIONS FOR SURFACE METROLOGY

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COPLANARITY MEASUREMENT

Our optical systems measure even highly reflective materials (i.e. bumps).

  1. COPLANARITY OF A MICRO BGA

  2. SURFACE IMAGE OF A MICRO BGA

  3. COPLANARITY OF A SMT COMPONENT

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FLATNESS MEASUREMENT

Measuring the flatness of electronic components
and wafers

  1. CONTOUR MAP OF IC COMPONENT- Advanced etch removing and modifiying algorithms

  2. SURFACE OF A WAFER- Accurate flatness measurement over large areas

  3. 3D IMAGE DIE TILT- Measures Die Tilt, BLT height and Position

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SURFACE ROUGHNESS

Non-contact and fast surface roughness measurement according to international standards.

  1. GLASS, MIRRORS, WAFERS- WLI is ideal for smooth and super smooth surfaces

  2. SURFACE DEFECT DETECTION- Find defects or particels automatically. Measures height, position and size of defects

  3. ELECTRICAL CONTACT SURFACE- 400 µm range, fast scanning speed. CFM Scan with 100X magnification, 0,23 µm lateral and 1 nm height resolution

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THICKFILM MEASUREMENT

Measuring the thickness of various print layers
on hybrid substrates

  1. HYBRIDCIRCUIT- SURFACE OF A THICK-FILM RESISTOR

  2. SOLAR CELL- SURFACE OF METALLIZATION LAYER

  3. EPOXY PRINT- 3D volume, height and area measurements

  4. MULTI-LAYER CERAMIC CAPACITOR (MLCC)- PROFILE OF PRINT ON A MLCC TAPE

  5. FUEL CELL- PROFILE OF LARGE PRINT DEPOSIT ON FUEL CELL COMPONENT

  6. DRAM EPOXY PRINT- PROFILE OF EPOXY DEPOTS ON A DRAM SUBSTRATE

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TOTAL THICKNESS VARIATION (TTV)

The CT T Series of cyberTECHNOLOGIES is designed for measuring top and bottom side of parts like wafers, substrates, or other mechanical parts. The system measures absolute thickness, thickness variation (TTV), bow and warp, and with an adapter plate to the system can be used as a standard surface measurement system.

  1. SILICON WAFER- 3D THICKNESS MAP OF A SILICON WAFER

  2. FUEL CELL- 3D IMAGE OF THE FRONT AND BACK-SIDE A FUEL CELL ANODE

  3. SOLAR CELL- 2D PROFILE OF FRONT- AND BACK-SIDE METALLIZATION LAYER

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TRANSPARENT FILMS AND COATINGS

Transparent films or deposits such as flux or epoxy are difficult to qualify and quantify. While certain materials are invisible for microscopes or AOI systems, our measurement systems can differentiate between several surface layers.

  1. LED DEVICES- Measurement of multilayer films (up to 4 layers). Distance sensors can measure surface and thickness.

  2. FLUX DEPOSIT- Volume, height and area measurement on transparent deposits

  3. COATINGS- Thickness measurement of conformal coatings down to 2 microns. Different interferometer types for a variety of materials

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