PL NANOTECHNOLOGY PTE LTD

(Co/GST reg #201015487Z)

Email : INFO@PLNANO.COM

SINGAPORE/ PHILIPPINES :

No. 27 Woodlands Industrial Park E1 #03-02 SINGAPORE 757718

T: +65 6891 2405 F: +65 6464 9751

 

JOHOR BAHRU :

Address : 33-01, Jalan Sagu 18, Taman Daya, 81100 Johor Bahru, Johor Malaysia.

M : +6016 726 0680

KUALA LUMPUR :

Address : C5-6-7, Block C, SetiaWalk, Persiaran Wawasan, 47100 Puchong, Selangor Malaysia.

M : +6016 726 0680

©2019 by PL NANOTECHNOLOGY PTE LTD.

Applications Overview

SOLUTIONS FOR SURFACE METROLOGY

Coplanarity_Measurement_BGA_3D_cyberTECHNOLOGIES.jpg

1/3

COPLANARITY MEASUREMENT

Our optical systems measure even highly reflective materials (i.e. bumps).

  1. COPLANARITY OF A MICRO BGA

  2. SURFACE IMAGE OF A MICRO BGA

  3. COPLANARITY OF A SMT COMPONENT

Measure-flatness-wafer-surface_cyberTEHNOLOGOIES_2.jpg

1/4

FLATNESS MEASUREMENT

Measuring the flatness of electronic components
and wafers

  1. CONTOUR MAP OF IC COMPONENT- Advanced etch removing and modifiying algorithms

  2. SURFACE OF A WAFER- Accurate flatness measurement over large areas

  3. 3D IMAGE DIE TILT- Measures Die Tilt, BLT height and Position

surface-roughness-measurement-of-glas.png

1/6

SURFACE ROUGHNESS

Non-contact and fast surface roughness measurement according to international standards.

  1. GLASS, MIRRORS, WAFERS- WLI is ideal for smooth and super smooth surfaces

  2. SURFACE DEFECT DETECTION- Find defects or particels automatically. Measures height, position and size of defects

  3. ELECTRICAL CONTACT SURFACE- 400 µm range, fast scanning speed. CFM Scan with 100X magnification, 0,23 µm lateral and 1 nm height resolution

HYBRIDCIRCUIT_3D.jpg

1/11

THICKFILM MEASUREMENT

Measuring the thickness of various print layers
on hybrid substrates

  1. HYBRIDCIRCUIT- SURFACE OF A THICK-FILM RESISTOR

  2. SOLAR CELL- SURFACE OF METALLIZATION LAYER

  3. EPOXY PRINT- 3D volume, height and area measurements

  4. MULTI-LAYER CERAMIC CAPACITOR (MLCC)- PROFILE OF PRINT ON A MLCC TAPE

  5. FUEL CELL- PROFILE OF LARGE PRINT DEPOSIT ON FUEL CELL COMPONENT

  6. DRAM EPOXY PRINT- PROFILE OF EPOXY DEPOTS ON A DRAM SUBSTRATE

thickness_silicon_wafer_haupt.jpg

1/3

TOTAL THICKNESS VARIATION (TTV)

The CT T Series of cyberTECHNOLOGIES is designed for measuring top and bottom side of parts like wafers, substrates, or other mechanical parts. The system measures absolute thickness, thickness variation (TTV), bow and warp, and with an adapter plate to the system can be used as a standard surface measurement system.

  1. SILICON WAFER- 3D THICKNESS MAP OF A SILICON WAFER

  2. FUEL CELL- 3D IMAGE OF THE FRONT AND BACK-SIDE A FUEL CELL ANODE

  3. SOLAR CELL- 2D PROFILE OF FRONT- AND BACK-SIDE METALLIZATION LAYER

LED-devices.jpg

1/3

TRANSPARENT FILMS AND COATINGS

Transparent films or deposits such as flux or epoxy are difficult to qualify and quantify. While certain materials are invisible for microscopes or AOI systems, our measurement systems can differentiate between several surface layers.

  1. LED DEVICES- Measurement of multilayer films (up to 4 layers). Distance sensors can measure surface and thickness.

  2. FLUX DEPOSIT- Volume, height and area measurement on transparent deposits

  3. COATINGS- Thickness measurement of conformal coatings down to 2 microns. Different interferometer types for a variety of materials

Tell us how we can help you !!

We know it takes a little time...But please register so we can email data sheet to you.